| Process | Item | Paremeter |
| Max PCB print size | 900*600mm² | |
| Max board weight | 8kg | |
| Assembly | Minimum accuracy | 1005 |
| Component | 0.2-25mm | |
| Min distance between BGA | 0.25-2.0mm | |
| BGA size | 0.1-0.63mm | |
| Min QFP size | 0.35mm | |
| Min board size | 50*30mm | |
| Max board size | 850*560mm | |
| Precision | ±22μm（3σ），±0.05°（3σ） | |
| Board thickness range | 0.3mm--6mm | |
| Max board weight | 6kg | |
| Max material placement types | 500 | |
| SPI | Min solder balls distance | 100μm |
| X-Y Precision | 0.5μm | |
| False test rate | ≤0.1% | |
| AOI | Min component | 1005 |
| Defect types | Wrong material,missing material、wrong direction、Deviation、Open welding,etc | |
| Upturned pin | 3D test | |
| Backflow | Temperature accuracy | ±1℃ |
| Welding protection | Nitrogen protction（Remaining oxygen＜3000ppm） | |
| Nitrogen control | Nitrogen closed loop automatic control system，±200ppm | |
| Product type | Rigid,Flex,Rigid-flex |
Shenzhen Tongtai Intelligent Manufacturing Technology Development Co., Ltd.
Add: 3rd Floor, Building D, ZhengChangDa Digital Technology Park, Jian 'An Road,Zhan Cheng Community,FuHai Street, BaoAn District, ShenZhen
Tel: 0755-23721330
Fax: 0755-23318332
Website: www.tontektechnology.com
E-mail: kevin.zhang@tontektechnology.com
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