PCB Design-Shenzhen Tongtai Intelligent Manufacturing Technology Development Co., Ltd.

PCB Design

Toingtai's design team has employee over 100, and they have an average working experience of 10 years. We have been serving more than 1000 customers from 20+ countries.
Our design capabilities including High speed, Schematic Caputure, Digital-analog hybrid, high density, high voltage, high power, radio frequency, ATE, backplate,etc. PCB type covers Rigid, Flex, Rigid-flex, up to 40 layer. Capable of Blind and buried Vias, Impedance control, 25Gbps diff pair with 100cm.
Main design tools including: Allegro, Pads, Altium, Mentor, CIS/ORCAD, Concept-HDL, Protel DXP, Montor DxDesigner, Design Capture.

Design Capability	Design EXP
Max Pin Qty	6W-10W
Max connection position	4W
Max design layout count	68L
Max Power consumption	360W
HDI	1+N+1,2+N+2,.....X+N+X
High speed Diff pair	2009	10Gbps,76cm
	2012	14Gbps,100cm
	2013	28Gbps,10.6cm

Pin Qty	Lead time(WDs)
0-1000	3-5
2000-3000	5-7
4000-5000	8-12
6000-7000	12-15
8000-9000	15-18
10000-13000	18-20
14000-15000	20-22
16000-20000	22-30
Fastest delivery	10000pin/6 day

PCB Design Cases

Intel Industrial Control Mainboard

Customer's requirement:
The product use intel H81,it's Mini-ITX board and carry DDR3L. It has multifunction—double Realtek RTL8111E, PCIE 16X, 10 different COM serial port, PRINT, LVDS, MSATA, MPCIE, SATA Port, 8*USB, VGA interface, PS/2, audio port and Pin. The whole board layout is of high density.
Our solution:
Use reasonable planning, parallel design, and the exsited space to deal with the problem of power interference.
Customer's feedback:
First version debugging smoothly.

Communication Mainboard

Technic difficulty：
The PCB size is too small and the board density is very high. It adopts CPLD of laters and PFGA of TI. Four connectors need to be buckled on a bottom plate, and three of them are basically differential signals, making it very difficult to wire out the BGA. Four positioning holes needed to be scoop out of the middle of the board.
Design method:
Except to keep the signal, we must keep the appearance clean. We evaluate the multilayer board design according to BGA wire out, not only to ensure signal integrity, but also to ensure sufficient supply current of BGA.
Customer's feedback:
First version debugging smoothly.

Communication board simulation design case

Introduction:
This board has 60000 pin in total, and customer required to finish the design, simulation and board production within one month. There are many types of small voltage and high current power supplies on the board, and there are various interface type.
Interface：SFP+, Interlaken, QPI, PCIE3, DDR4 and DDR3 signal,etc.
Standards：SFF8431, QPI3.0, PCIE3.0, JESD79-4, JESD79-3E, etc.
Rate：10.3125Gbps, 12.5Gbps, 8Gbps,etc.
Simulation description:
High-speed serial signal such as PCIE3 and QPI are using Intel's platform, which required to meet these conditions:• -0.80 dB/inch at 4 GHz and -1.60 dB/inch at 8 GHz for stripline routing• -0.84 dB/inch at 4 GHz and -1.68 dB/inch at 8 GHz for microstrip routing. We found out normal FR material couldn't meet these requirement after our evaluation, therefore, we must change the material. Finally, we selected TU872SLK-sp material after simulation, and this didn't change the original line width and space.

Multilayer Backplane

Technic difficulty:
This project has more than 10 pairs' 10G signal,customer care about the backplane signal integrity too much.
Our solution:
Through close communication with customer, and close cooperation with customer's PCB supplier and connector suppliers, use simulation method to process on the system of the Backplane,and proposed reasonable suggestions for the customer's backplane signal planning.
Result:
The Backplane passed functional test successfully, task completed.